SIFSIX-1-Cu


SIFSIX-1-Cu

Catalog:CDM-CH028

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Specifications
Synonym Cu-HHB
Common Use Electrode materials
Structure SIFSIX-1-Cu
Molecular Weight 517.99
Molecular Formula C20H16CuF6N4Si
CAS No. 288297-89-2
Appearance White Powder
Storage Store at room temperature or 4 °C in dry-state. Recommend to be activated at 80 ℃ in a vacuum oven for 12 hours before use
Pore Volume 0.43 cm³/g
Pore Size 1.1 nm
Specific Surface 130 m²/g (by BET)
Stability Thermal stability: 240°C;
Stable in air and in water.
Size 50-200 nm
Metal Cu
Ligand Tetrahydroxyquinone (CAS: 319-89-1)
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